TGlobal TG Series Thermal Interface Pad, 1mm Thick, 2.2W/m·K, Silicone

The TGlobal Ultra Soft Thermal Pad is a high-performance thermal interface material designed for high-power electronic applications. It features a single sticky side for easy assembly and offers high thermal conductivity, making it ideal for efficient heat dissipation. This thermal pad is suitable for use in a wide range of industries, including 5G, aerospace, AI, AIoT, AR/VR/MR/XR, automotive, consumer devices, Datacom, electric vehicles, electronic products, energy storage, industrial equipment, lighting, medical devices, military applications, Netcom, panels, power electronics, robotics, servers, smart home technologies, and telecommunications.

Ultra soft and good compressibility
Good insulation
RoHS and REACH compliant
UL Compliant