TE Connectivity, Sigma 3650, 1008 Unshielded Wire-wound SMD Inductor 8.2 μH 5% 170mA Idc Q:15
- RS Stock No.:
- 481-697
- Mfr. Part No.:
- 4-1879023-7
- Brand:
- TE Connectivity
Subtotal (1 reel of 2000 units)*
£378.00
(exc. VAT)
£454.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 01 December 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
2000 + | £0.189 | £378.00 |
*price indicative
- RS Stock No.:
- 481-697
- Mfr. Part No.:
- 4-1879023-7
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Inductance | 8.2 μH | |
Maximum DC Current | 170mA | |
Package/Case | 1008 | |
Length | 2.92mm | |
Shielded | No | |
Tolerance | 5% | |
Series | Sigma 3650 | |
Minimum Quality Factor | 15 | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Inductance 8.2 μH | ||
Maximum DC Current 170mA | ||
Package/Case 1008 | ||
Length 2.92mm | ||
Shielded No | ||
Tolerance 5% | ||
Series Sigma 3650 | ||
Minimum Quality Factor 15 | ||
- COO (Country of Origin):
- TW
The TE Connectivity High-frequency inductor is designed for applications requiring outstanding inductance performance and reliability. With a robust build, it offers a blend of efficiency and compactness, making it an ideal choice for modern electronics. The inductors wire-wound element type ensures superb signal integrity while maintaining minimal space on your PCB. Engineered to operate across a broad temperature range, this part is perfect for environments where thermal constraints are prevalent. Its surface mount design simplifies integration into various circuit layouts, providing a seamless fit for high-performance devices. Whether you're developing complex RF applications or high-frequency circuits, this inductor promises to deliver uncompromising results in a compact package, making it a versatile component in your design toolkit.
Optimised for high-frequency applications, ensuring minimal signal distortion
Surface mount configuration allows for efficient PCB layout
Designed to withstand wide temperature variations, enhancing stability
Low DC resistance contributes to improved energy efficiency
Compact size meets the demands of modern electronic designs
Taped and reeled packaging facilitates automated assembly
Quality factor indicates excellent performance in RF applications
Compliant with EU RoHS and REACH regulations for environmental safety
Surface mount configuration allows for efficient PCB layout
Designed to withstand wide temperature variations, enhancing stability
Low DC resistance contributes to improved energy efficiency
Compact size meets the demands of modern electronic designs
Taped and reeled packaging facilitates automated assembly
Quality factor indicates excellent performance in RF applications
Compliant with EU RoHS and REACH regulations for environmental safety
Related links
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