TE Connectivity, Sigma 3650, 1008 Unshielded Surface Mount Inductor 8.2 μH 5 % 170 mA Idc Q:15

View all Surface Mount Inductors

Subtotal (1 reel of 2000 units)*

£378.00

(exc. VAT)

£454.00

(inc. VAT)

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  • Ready to ship from 19 August 2026
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Units
Per unit
Per Reel*
2000 +£0.189£378.00

*price indicative

RS Stock No.:
481-697
Distrelec Article No.:
304-59-714
Mfr. Part No.:
4-1879023-7
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

Surface Mount Inductor

Inductance

8.2μH

Maximum DC Current

170mA

Package/Case

1008

Length

2.92mm

Packaging

Tape & Reel

Automotive Standard

No

Shielding

No

Minimum Operating Temperature

-40°C

Maximum DC Resistance

6Ω

Series

Sigma 3650

Inductance Tolerance

5 %

Maximum Operating Temperature

125°C

Standards/Approvals

2016 Compliant, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, China RoHS 2 Directive MIIT Order No 32

Depth

2.79mm

Height

2.13mm

Maximum Self Resonant Frequency

0.025GHz

Inductor Construction

Wirewound

Minimum Quality Factor

15

COO (Country of Origin):
TW
The TE Connectivity High-frequency inductor is designed for applications requiring outstanding inductance performance and reliability. With a robust build, it offers a blend of efficiency and compactness, making it an ideal choice for modern electronics. The inductor’s wire-wound element type ensures superb signal integrity while maintaining minimal space on your PCB. Engineered to operate across a broad temperature range, this part is perfect for environments where thermal constraints are prevalent. Its surface mount design simplifies integration into various circuit layouts, providing a seamless fit for high-performance devices. Whether you're developing complex RF applications or high-frequency circuits, this inductor promises to deliver uncompromising results in a compact package, making it a versatile component in your design toolkit.

Optimised for high-frequency applications, ensuring minimal signal distortion

Surface mount configuration allows for efficient PCB layout

Designed to withstand wide temperature variations, enhancing stability

Low DC resistance contributes to improved energy efficiency

Compact size meets the demands of modern electronic designs

Taped and reeled packaging facilitates automated assembly

Quality factor indicates excellent performance in RF applications

Compliant with EU RoHS and REACH regulations for environmental safety

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