TE Connectivity, Sigma 3650, 0402 Wire-wound SMD Inductor 39 nH 5% 200mA Idc Q:25
- RS Stock No.:
- 473-308
- Mfr. Part No.:
- 5-1624112-3
- Brand:
- TE Connectivity
Subtotal (1 reel of 2000 units)*
£470.00
(exc. VAT)
£564.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 17 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
2000 + | £0.235 | £470.00 |
*price indicative
- RS Stock No.:
- 473-308
- Mfr. Part No.:
- 5-1624112-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Inductance | 39 nH | |
Maximum DC Current | 200mA | |
Package/Case | 0402 | |
Length | 1.27mm | |
Depth | 0.61mm | |
Tolerance | 5% | |
Series | Sigma 3650 | |
Minimum Quality Factor | 25 | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Inductance 39 nH | ||
Maximum DC Current 200mA | ||
Package/Case 0402 | ||
Length 1.27mm | ||
Depth 0.61mm | ||
Tolerance 5% | ||
Series Sigma 3650 | ||
Minimum Quality Factor 25 | ||
- COO (Country of Origin):
- TW
The TE Connectivity High frequency inductor combines advanced engineering with precise performance, making it an invaluable component for a variety of electronic applications. Designed for surface mount technology, it features a compact 0402 package size, ensuring efficiency and optimal space utilization on circuit boards. The inductor is characterised by its low inductance of .039 μH and robust current rating of 200 mA, offering reliability in high-frequency operations. With a DC resistance of just .55 ohms, it minimises energy loss and enhances overall circuit performance. Built to withstand operational temperatures from -40 to 125 °C, this inductor is reliable even in demanding environments. The Sigma 3650 series exemplifies quality and precision, catering to the needs of modern electronic devices and applications.
Surface mount design streamlines assembly processes
Optimised for high frequency applications to enhance signal integrity
Compact dimensions save valuable PCB space
Low DC resistance promotes energy efficiency
Wide operating temperature range ensures compatibility with various environments
Taped and reeled packaging simplifies handling and placement
Wire wound construction supports enhanced performance levels
Compliant with key environmental directives for responsible sourcing
Optimised for high frequency applications to enhance signal integrity
Compact dimensions save valuable PCB space
Low DC resistance promotes energy efficiency
Wide operating temperature range ensures compatibility with various environments
Taped and reeled packaging simplifies handling and placement
Wire wound construction supports enhanced performance levels
Compliant with key environmental directives for responsible sourcing
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