This lead-free solder features a 1.2mm wire diameter and comes in a 500g roll, primarily composed of tin with silver and copper additions. It is tailored for electronics soldering applications, ensuring strong and durable connections. The alloy consists of 96.5% tin, 3% silver, and 0.5% copper, offering an effective solution for various soldering requirements. The melting point is between 217°C and 221°C, making it suitable for high-temperature tasks.

• Continuous flux core promotes joint reliability
• Halogen-free formulation reduces environmental impact
• Low flux content minimises residue following soldering
• High melting point ensures durability under stress
• Good wetting characteristics facilitate effective solder flow
• Reduced tip consumption prolongs tool life

• Precision electronics soldering
• Automotive component assembly
• Circuit board repairs and prototypes
• Suitable for both hobbyist and professional projects

Yes, it can withstand high soldering temperatures.

Yes, it features low splash and no-clean flux.

Yes, it significantly reduces iron tip consumption.