MG Chemicals 832C-375ML Translucent Epoxy Epoxy Resin Adhesive 375 ml

View all Potting Compounds
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£35.75

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£42.90

(inc. VAT)

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1 - 5£35.75
6 - 14£34.33
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RS Stock No.:
918-4986
Mfr. Part No.:
832C-375ML
Brand:
MG Chemicals
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Brand

MG Chemicals

Product Material

Epoxy

Package Type

Can

Package Size

375 ml

Cure Time

35 min → 24 h

Colour

Translucent

Maximum Operating Temperature

+145°C

Minimum Operating Temperature

-30°C

Chemical Composition

Alkyl Glycidyl Ether, Bisphenol A, C18-Unsaturated, Dimers, Epoxy Resin, Fatty Acids, Reaction Products with Polyethylenepolyamines, Triethylenetetramine

Operating Temperature Range

-30 → +145 °C

Setting Time

60min

Physical Form

Liquid

Viscosity Measurement

3300cP/s

COO (Country of Origin):
CA

MG Chemicals Epoxy Potting Compounds


The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.

Feature and Benefits


Impact resistant
Non-conductive
Low toxicity
Improves reliability and operational range
Non-porous, water and chemical resistant
Hard to remove
Available in different colours

Typical Applications


Aviation Industry
Communication Industry
Marine Industry
Car industry

Note

Refer to the datasheet for more details on how to apply and applications

Caution

Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins


Potting Compounds


The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.

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