TE Connectivity CFP4 Heat Sink for CFP4, 2288231-6

The TE Connectivity CP4 heatsink, designed for front-to-back airflow, offers efficient thermal management essential for maintaining optimal performance in electronic applications. This innovative heatsink is tailored to enhance cooling effectiveness while ensuring reliable operation of associated components. Its robust construction is indicative of high-quality manufacturing, aimed at providing longevity and consistent performance. With an emphasis on design simplicity, it integrates seamlessly into various systems, making it a versatile choice for engineers and designers alike. The CP4 heatsink is ideal for those seeking a dependable solution to minimize overheating in critical environments, thereby prolonging the lifespan of electronic devices. As part of TE's commitment to quality, this heatsink meets stringent compliance standards, ensuring peace of mind for users passionate about sustainability and environmental responsibility.

Optimized for front-to-back airflow, enhancing overall cooling efficiency
Durable construction ensures long-term reliability in demanding applications
Designed for easy integration into a variety of electronic systems
Provides dependable thermal management, minimizing overheating risks
Supports compliance with environmental regulations, promoting sustainability