TE Connectivity Dynamic 3000 Series Vertical Board PCB Header, 6 Contact(s), 5.08 mm Pitch, 2 Row, Shrouded

Subtotal (1 tube of 80 units)*

£179.71

(exc. VAT)

£215.65

(inc. VAT)

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  • Ready to ship from 10 July 2026
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Tube(s)
Per Tube
Per unit*
1 +£179.71£2.246

*price indicative

RS Stock No.:
506-903
Distrelec Article No.:
304-50-460
Mfr. Part No.:
2-178140-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

Dynamic 3000

Product Type

PCB Header

Pitch

5.08mm

Current

8A

Housing Material

Fibreglass Polyester

Number of Contacts

6

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder

Row Pitch

5.08mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is designed for versatile use in various electronic applications, providing a reliable connection in wire-to-board setups. The product boasts a vertical orientation and centreline spacing of 5.08 mm, making it ideal for compact circuit board designs. Fully shrouded and constructed from durable materials, this connector ensures optimal performance and longevity while maintaining ease of use during installation. With a robust construction that conforms to strict industry standards, it supports both power and signal circuits, guaranteeing efficient operation in demanding conditions.

Designed for use in high-density applications with a compact footprint

Offers excellent mating retention for secure connections

Constructed using high-quality polyester GF for enhanced durability

Available with a tin plating for improved conductivity

Compatible with a wide range of connector assemblies for flexibility

Supports a temperature range suitable for diverse operational environments

Provides ease of assembly with through-hole solder termination

Features a polarisation mechanism to ensure correct alignment during mating

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