TE Connectivity AMPMODU Series Vertical Board PCB Header, 50 Contact(s), 2.54 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 tray of 9 units)*

£167.40

(exc. VAT)

£200.88

(inc. VAT)

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Tray(s)
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Per unit*
1 +£167.40£18.60

*price indicative

RS Stock No.:
501-769
Mfr. Part No.:
2-103169-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

50

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-53-742

Non Compliant

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is expertly designed for vertical board-to-board connections, offering a reliable and efficient solution for your electronic assembly needs. This fully shrouded component features a 50-position setup with a centreline of 2.54 mm, ensuring compact integration into diverse applications. Utilising gold plating for enhanced conductivity and durability, the design accommodates through-hole soldering for straightforward installation into printed circuit boards. With commendable insulation resistance and dielectric strength, this product stands ready to support robust electrical applications while safeguarding against potential current leakage. Ideal for those seeking quality and dependability, this connector optimally balances performance and ease of use across a myriad of electronic environments, making it a preferred choice for both engineers and hobbyists alike.

Designed for reliable board-to-board connectivity in dense assemblies

Fully shrouded header enhances protection against misalignments

Nickel underplating and gold contacts ensure superior contact reliability

Compact format facilitates space-saving designs in electronic devices

High insulation resistance assists in preventing short-circuits

Wave solderable up to 240°C for versatile assembly processes

Low profile design supports various application environments

Durable thermoplastic housing withstands standard operational temperatures

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