TE Connectivity AMP-LATCH Series Vertical Through Hole PCB Connector, 10 Contact(s), 2.54 mm Pitch, 2 Row(s), Unshrouded

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Subtotal (1 tube of 50 units)*

£206.48

(exc. VAT)

£247.78

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£206.48£4.13

*price indicative

RS Stock No.:
480-806
Mfr. Part No.:
1658624-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMP-LATCH

Product Type

PCB Connector

Current

1A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

10

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Contact Plating

Gold Flash over Nickel

Termination Type

IDC

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

RoHS

Voltage

250 V

Distrelec Product Id

304-50-259

COO (Country of Origin):
CN
The TE Connectivity Wire-to-Board connector is expertly designed for seamless integration in modern electronic applications. This high-performance component features a vertical orientation and is configured with 10 positions along a 2.54 mm centreline, ensuring efficient connectivity while occupying minimal board space. With a reliable through-hole solder termination method, it guarantees solid connections essential for robust communications. Its low-profile height and durable thermoplastic housing provide both functional and aesthetic advantages for various designs. The connector's versatility makes it suitable for a range of uses, especially in environments requiring dependable electrical performance and compatibility with ribbon cables.

Designed for efficient vertical PCB mounting

Constructed with a robust thermoplastic housing for durability

Compatible with standard ribbon cable specifications

Features a precise mating alignment mechanism

Offers high insulation resistance for enhanced safety

Supports a wide operating temperature range for versatile applications

Enables easy installation with its through-hole solder method

Integrates seamlessly into existing soldering processes

Low-profile design ensures space-efficient implementations

Provides reliable connection longevity through quality materials

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