TE Connectivity 51791 Series Vertical Board PCB Header, 40 Contact(s), 0.8 mm Pitch, 2 Row(s), Unshrouded

Subtotal (1 reel of 900 units)*

£2,434.49

(exc. VAT)

£2,921.39

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£2,434.49£2.705

*price indicative

RS Stock No.:
478-806
Mfr. Part No.:
5179160-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

51791

Current

0.5A

Pitch

0.8mm

Housing Material

Natural

Number of Contacts

40

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Row Pitch

0.8mm

Termination Type

Surface Mount

Maximum Operating Temperature

125°C

Contact Gender

Female

Standards/Approvals

UL 94 V-0

Voltage

100 V

Distrelec Product Id

304-54-242

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Receptacle is designed with versatility and reliability in mind, making it an essential component for various applications. Featuring a sturdy vertical orientation and a precision-engineered board-to-board connection, this receptacle is crafted for seamless integration into your assemblies. It supports 40 positions with a compact .8 mm centreline, allowing for efficient space utilisation on your printed circuit boards. Constructed from high-quality materials, this component excels in durability and performance, ensuring a robust connection under demanding conditions. With advanced features such as gold plating for superior conductivity and a natural colour finish, it meets various industry standards, providing peace of mind in your electronic designs.

Ensures robust connections with advanced plating technology

Meets rigorous industry standards for reliability

Supports stackable configurations for versatile assembly options

Facilitates quick and easy installation with its surface mount termination method

Provides excellent insulation resistance for added safety

Designed for optimal signal integrity in electronic applications

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