Molex 503308 Series Vertical Surface Mount PCB Header, 50 Contact(s), 0.4mm Pitch, 2 Row(s), Unshrouded
- RS Stock No.:
- 478-727
- Mfr. Part No.:
- 503308-5010
- Brand:
- Molex
Subtotal (1 reel of 3000 units)*
£4,856.30
(exc. VAT)
£5,827.56
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 11 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per unit* |
---|---|---|
1 + | £4,856.30 | £1.619 |
*price indicative
- RS Stock No.:
- 478-727
- Mfr. Part No.:
- 503308-5010
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Series | 503308 | |
Pitch | 0.4mm | |
Number of Contacts | 50 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Unshrouded | |
Mounting Type | Surface Mount | |
Select all | ||
---|---|---|
Brand Molex | ||
Series 503308 | ||
Pitch 0.4mm | ||
Number of Contacts 50 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Surface Mount | ||
- COO (Country of Origin):
- JP
The TE Connectivity 0.40mm pitch board-to-board connector is designed for applications demanding high-density interconnection. With its dual-row vertical stacking configuration and a compact mated height of just 0.70mm, this connector effectively maximises space on printed circuit boards while ensuring reliable signal integrity. Tailored for surface mount technology, it caters to evolving electronic designs that require versatility and performance. The product stands out not only for its robust copper alloy construction but also for its low-halogen resin, ensuring environmental compliance without compromising on durability. Ideal for signal applications, this connector is your go-to solution for seamless integration in compact electronic devices.
Dual-row design optimises board space usage
Vertical stacking enhances flexibility in layout
Surface mount technology ensures easy assembly
Copper alloy construction provides superior conductivity
Low-halogen material meets stringent environmental standards
Durability with a maximum of 30 mating cycles ensures longevity
Rated for a broad temperature range of -40°C to +85°C
Compact form factor suits high-density applications
Vertical stacking enhances flexibility in layout
Surface mount technology ensures easy assembly
Copper alloy construction provides superior conductivity
Low-halogen material meets stringent environmental standards
Durability with a maximum of 30 mating cycles ensures longevity
Rated for a broad temperature range of -40°C to +85°C
Compact form factor suits high-density applications
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