TE Connectivity AMPMODU Series Right Angle Board PCB Header, 60 Contact(s), 2.54 mm Pitch, 2 Row

Subtotal (1 tube of 35 units)*

£256.68

(exc. VAT)

£308.02

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£256.68£7.334

*price indicative

RS Stock No.:
477-339
Distrelec Article No.:
304-54-042
Mfr. Part No.:
3-535512-0
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

2A

Pitch

2.54mm

Housing Material

Fibreglass Polyester

Number of Contacts

60

Number of Rows

2

Orientation

Right Angle

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Contact Gender

Female

Tail Pin Length

2.92mm

Maximum Operating Temperature

105°C

Mating Pin Length

3mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

333 V

Non Compliant

COO (Country of Origin):
TW
The TE Connectivity PCB Mount Receptacle is an innovative solution designed for board-to-board connections, providing exceptional reliability and performance in compact applications. Engineered with a right-angle orientation, this 60-position receptacle ensures efficient use of space while maintaining robust electrical properties. Its gold-plated contacts offer superior conductivity and corrosion resistance, making it ideal for high-performance electronic devices. Built to withstand harsh operating conditions, the receptacle features a standard connector profile and is suitable for various applications, including signal interfacing in industrial automation and consumer electronics. The Modu Connector System enhances installation flexibility, while its through-hole soldering method guarantees secure attachment to printed circuit boards.

Designed for high-density applications, optimising space without compromising performance

Gold plating on contacts enhances conductivity and ensures longevity

Standard connector profile facilitates ease of integration into existing designs

High-temperature housing material withstands demanding operational environments

Designed for a variety of industry standards, ensuring broad compatibility

Seamless assembly maximises operational efficiency during installation

Stackable configuration provides flexible and modular options for assembly

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