Subtotal (1 reel of 1200 units)*
£479.02
(exc. VAT)
£574.82
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 10 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s) | Per Reel | Per unit* |
---|---|---|
1 + | £479.02 | £0.399 |
*price indicative
- RS Stock No.:
- 472-025
- Mfr. Part No.:
- 502386-1370
- Brand:
- Molex
Technical Reference
Legislation and Compliance
Product Details
- COO (Country of Origin):
- MY
The TE Connectivity 1.25mm Pitch Wire-to-Board PCB Receptacle is a robust solution designed to ensure reliable connections in various electronic applications. This receptacle features a single-row, right-angle design that promotes ease of use in space-constrained environments. With a tin plating that enhances conductivity and resistance to corrosion, this component guarantees superior performance and longevity. Its compatibility with 13 circuits makes it an efficient option for complex circuitry requirements, while its high-temperature thermoplastic material offers resilience against extreme operational conditions. Whether you're designing a new product or upgrading an existing one, this receptacle stands out for its engineering excellence and compliance with stringent industry standards.
Designed for easy integration in PCB applications
Maximises electrical performance with superior materials
Offers reliable connections even in challenging environments
Enables efficient signal transmission with minimal resistance
Compliments various configurations with its right-angle orientation
Facilitates seamless assembly processes in automated settings
Enhances design flexibility through its compact footprint
Maximises electrical performance with superior materials
Offers reliable connections even in challenging environments
Enables efficient signal transmission with minimal resistance
Compliments various configurations with its right-angle orientation
Facilitates seamless assembly processes in automated settings
Enhances design flexibility through its compact footprint
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