onsemi Isolated PowerTrench 2 Type P-Channel MOSFET, 830 mA, 20 V Enhancement, 6-Pin SC-89 FDY1002PZ

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Packaging Options:
RS Stock No.:
807-0713
Mfr. Part No.:
FDY1002PZ
Brand:
onsemi
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Brand

onsemi

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

830mA

Maximum Drain Source Voltage Vds

20V

Package Type

SC-89

Series

PowerTrench

Mount Type

Surface

Pin Count

6

Maximum Drain Source Resistance Rds

1.8Ω

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

8 V

Forward Voltage Vf

-1V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

625mW

Typical Gate Charge Qg @ Vgs

2.2nC

Transistor Configuration

Isolated

Maximum Operating Temperature

150°C

Standards/Approvals

No

Height

0.6mm

Width

1.2 mm

Length

1.7mm

Number of Elements per Chip

2

Automotive Standard

No

PowerTrench® Dual P-Channel MOSFET, Fairchild Semiconductor


PowerTrench® MOSFETs are optimised power switches that offer increase of system efficiency and power density. They combine small gate charge(Qg), small reverse recovery charge(Qrr) and soft reverse recovery body diode, which contributes to fast switching of synchronous rectification in AC/DC power supplies.

The latest PowerTrench® MOSFETs, employ shielded-gate structure that provides charge balance. By utilizing this Advanced technology, the FOM (Figure of Merit) of these devices is significant lower than that of previous generation.

Soft body diode performance of the PowerTrench® MOSFETs is able to eliminate snubber circuit or replace a higher voltage rating MOSFET.

MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The Advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.

ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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