ROHM AG087FGD3HRB Type N-Channel Single MOSFETs, 40 A, -40 V Enhancement, 3-Pin TO-252 (TL) AG087FGD3HRBTL

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£1.33

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£1.596

(inc. VAT)

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2 - 18£0.665£1.33
20 - 48£0.585£1.17
50 - 198£0.525£1.05
200 - 998£0.425£0.85
1000 +£0.415£0.83

*price indicative

Packaging Options:
RS Stock No.:
687-378
Mfr. Part No.:
AG087FGD3HRBTL
Brand:
ROHM
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Brand

ROHM

Channel Type

Type N

Product Type

Single MOSFETs

Maximum Continuous Drain Current Id

40A

Maximum Drain Source Voltage Vds

-40V

Package Type

TO-252 (TL)

Series

AG087FGD3HRB

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

7.0mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

53W

Typical Gate Charge Qg @ Vgs

14.9nC

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

175°C

Length

10.50mm

Height

2.3mm

Standards/Approvals

RoHS, AEC-Q101

Automotive Standard

AEC-Q101

The ROHM Power MOSFET designed for automotive and industrial applications. This versatile component operates at a maximal drain-source voltage of 40V, enabling efficient control in power management systems. Built with advanced technology, it boasts a low on-state resistance of 7.0 mΩ, optimising power efficiency and thermal performance. AEC-Q101 qualified, this MOSFET is reliable even in rigorous automotive environments, making it a sound choice for engineers seeking durable solutions. Its robust thermal resistance and avalanched tested design ensure exceptional reliability under varied operating conditions, cementing its status as a go-to option for high-current applications.

Continuous drain current rated at ±40A, providing reliable performance in demanding scenarios

Breakdown voltage of 40V ensuring robust protection against over-voltage conditions

Low gate threshold voltage of 1.0V to 2.5V facilitating smoother operation and control

Compliant with AEC Q101 , highlighting its suitability for automotive applications

Exceptional thermal resistance of 2.80℃/W, enhancing heat dissipation and lifespan

100% avalanche tested, providing peace of mind in high-stress environments

Features a DPAK package, optimising footprint while supporting effective thermal management

Suitable for high efficiency designs in automotive and other high-current applications

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