TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Surface Mount DDR3 DIMM Socket ,1.5 V

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Subtotal (1 reel of 150 units)*

£943.58

(exc. VAT)

£1,132.30

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£943.58£6.291

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RS Stock No.:
478-604
Distrelec Article No.:
304-59-377
Mfr. Part No.:
2-2013310-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

204

Pitch

0.6mm

Mount Type

Surface

Housing Material

High Temperature Thermoplastic

SDRAM Type

DDR3

Latching

Yes

Termination Type

Surface Mount

Row Spacing

8.2mm

Maximum Operating Temperature

260°C

Standards/Approvals

UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32

Voltage

1.5 V

COO (Country of Origin):
CN
The TE Connectivity Emboss tape memory socket is engineered for excellence in performance and reliability. Designed specifically for high-speed memory applications, this socket accommodates 204 positions while ensuring a right-angle module orientation, which facilitates a compact assembly. With a stack height of 9.2 mm, it seamlessly fits into space-constrained environments. The robust construction features durable materials, including high-temperature thermoplastic housing and stainless steel latch components, ensuring long-lasting functionality under diverse conditions. Additionally, this model adheres to key industry standards, boasting compliance with EU RoHS and REACH regulations, ensuring that it meets the rigorous demands of today’s electronic market. By integrating this socket into your technology, you gain a dependable partner that supports optimal data processing capabilities.

High-performance memory support for DDR3 standards

Right-angle module orientation enhances installation flexibility

Stainless steel latch offers secure retention for memory modules

High-temperature thermoplastic housing withstands extreme conditions

Gold-plated contacts ensure superior electrical conductivity

Designed for seamless PCB surface mounting integration

Low halogen materials contribute to environmentally conscious manufacturing

Each unit is packaged to ensure efficient handling and volume management

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