TE Connectivity 1 mm Pitch 240 Way, Vertical Board Mount DDR3 DIMM Socket ,1.5 V, 500mA
- RS Stock No.:
- 473-011
- Distrelec Article No.:
- 304-59-202
- Mfr. Part No.:
- 1932031-5
- Brand:
- TE Connectivity
Subtotal (1 tray of 30 units)*
£159.40
(exc. VAT)
£191.28
(inc. VAT)
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Temporarily out of stock
- Shipping from 10 March 2026
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Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | £159.40 | £5.313 |
*price indicative
- RS Stock No.:
- 473-011
- Distrelec Article No.:
- 304-59-202
- Mfr. Part No.:
- 1932031-5
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | DIMM Socket | |
| Memory Socket Type | DIMM | |
| Orientation | Vertical | |
| Insertion/Removal Method | Direct Insert | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Board | |
| Housing Material | Nylon | |
| SDRAM Type | DDR3 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 105°C | |
| Row Spacing | 1.9mm | |
| Standards/Approvals | EU RoHS Directive 2011/65/EU, UL 94V-0 | |
| Voltage | 1.5 V | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type DIMM Socket | ||
Memory Socket Type DIMM | ||
Orientation Vertical | ||
Insertion/Removal Method Direct Insert | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Board | ||
Housing Material Nylon | ||
SDRAM Type DDR3 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 105°C | ||
Row Spacing 1.9mm | ||
Standards/Approvals EU RoHS Directive 2011/65/EU, UL 94V-0 | ||
Voltage 1.5 V | ||
- COO (Country of Origin):
- CN
The TE Connectivity double data rate (DDR) 3 memory socket is designed for board-to-board applications, featuring a robust construction with a 240-position configuration. The vertical module orientation ensures efficient use of space in various electronic devices. With its through-hole solder termination method, this socket offers a secure and reliable connection ideal for high-performance computing solutions. Developed to meet stringent electrical and mechanical specifications, it is well-suited to meet the demands of modern circuit applications. The innovative design incorporates features that enhance retention and alignment, making it a preferred choice for memory modules in a diverse range of applications.
Offers a circuit application tailored for signal processing
Constructed with high-temperature nylon for durability
Supports an operating temperature range of -55 to 105 °C
Incorporates a brass PCB retention feature for added stability
Delivers a reliable termination method through wave solder capability
Designed with an offset left mating alignment for improved usability
Utilises a standard connector profile that simplifies integration
Equipped with natural latch and housing colours for understated aesthetics
Facilitates a direct insert style for straightforward assembly
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