TE Connectivity 20-Way Connector Male for Board, 2 Row

Subtotal (1 pack of 20 units)*

£205.61

(exc. VAT)

£246.73

(inc. VAT)

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Pack(s)
Per Pack
Per unit*
1 +£205.61£10.281

*price indicative

RS Stock No.:
480-578
Distrelec Article No.:
304-55-291
Mfr. Part No.:
1761687-7
Brand:
TE Connectivity
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Brand

TE Connectivity

Number of Contacts

20

Product Type

Connector

Number of Rows

2

Current

1A

Pitch

2.54mm

Connector Gender

Male

Voltage

250 V

Mount Type

Board

Orientation

Vertical

Contact Plating

Gold

Termination Type

Solder

Contact Gender

Male

Standards/Approvals

UL 94 V-0

Housing Material

Polybutylene Terephthalate

Contact Material

Phosphor Bronze

COO (Country of Origin):
TW
The TE Connectivity IDC Low Profile HDR connector is meticulously designed for efficient wire-to-board connections, making it an ideal choice for compact electronic applications. Constructed for durability, it supports signal applications whilst ensuring reliability under varying operational conditions. The vertical configuration optimises space usage on PCBs, allowing engineers to achieve streamlined layouts without compromising on performance. With a robust housing material and thoughtful design, this connector can withstand the rigours of daily use, ensuring longevity and serviceability. Its smart alignment features and comprehensive compliance with industry standards provide peace of mind for manufacturers and developers alike.

Optimised vertical orientation maximises PCB space utilisation

Low-profile design enhances fit in compact applications

Daisy chain capability supports versatile circuit designs

Mating retention ensures secure connections during operation

Gold plating on mating areas delivers superior conductivity

High operating voltage rating accommodates diverse application needs

Wave solder capability simplifies assembly processes

Compliant with stringent RoHS directives for environmental safety

Packaging quantity of 50 caters to bulk project requirements

Sophisticated mechanical attachment promotes structural reliability

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