TE Connectivity Heatsink, SFP, PCB Through Hole

The TE Connectivity SFP Heat Sink is expertly engineered to enhance thermal management for SFP devices. With a pin fin design featuring 50 fins, this heat sink optimally dissipates heat generated during operation, ensuring reliable performance and longevity of electronic components. Crafted from cold-forged aluminium, it not only boasts a lightweight yet robust structure but is also low halogen compliant, making it a responsible choice for environmentally-conscious manufacturers. Designed with versatility in mind, it supports power ratings of up to 15 W, catering to a range of applications. The exceptional craftsmanship and compliance with EU directives underline the commitment to quality and sustainability, ensuring this product meets the evolving needs of modern technology.

Pin fin design allows for superior airflow and heat dissipation
Lightweight construction ensures easy integration into various electronic systems
Low halogen content contributes to environmentally friendly manufacturing processes
Durable cold-forged aluminium structure ensures long-lasting performance
Compliance with EU directives guarantees adherence to industry standards
Compatible with a variety of SFP devices for versatility in use
Power ratings of 5 W, 10 W, and 15 W cater to diverse power requirements