TE Connectivity Heatsink, BGA

The TE Connectivity Heat sink designed for BGA devices, offering exceptional thermal management capabilities. Crafted from high-quality aluminium and featuring a sleek black anodised finish, this component combines durability with performance. Its unique radial fin design ensures optimal airflow, enhancing heat dissipation. Whether you’re working on a demanding electronic application or need reliable heat management solutions, this product meets the stringent standards required for modern electronics. Built to comply with industry regulations, it undergoes rigorous testing to ensure it meets safety and compliance requirements. With multiple power ratings and an efficient design, this heat sink is an ideal choice for maintaining the longevity and efficiency of your devices.

Made from lightweight yet durable aluminium
Black anodised finish adds corrosion resistance
Designed with radial fins for enhanced airflow
Compliant with EU RoHS and ELV directives
Supports a range of air velocity options for efficient cooling
Low halogen content for safety in various applications
Offers flexibility with multiple power ratings for versatile usage