TE Connectivity, 2007709-1 1.9 mm Pitch Connector Backplane Connector, Right Angle Female, 16 Column, 9 Row, 144 Way

Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
RS Stock No.:
475-734
Distrelec Article No.:
304-48-763
Mfr. Part No.:
2007709-1
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Backplane Connector Type

Connector

Product Type

Backplane Connector

Current

0.75A

Number of Contacts

144

Orientation

Right Angle

Number of Columns

16

Connector Gender

Female

Voltage

30V

Number of Rows

9

Housing Material

Liquid Crystal Polymer Fibreglass

Pitch

1.9mm

Contact Material

Copper Alloy

Mount Type

Board

Contact Plating

Gold or Tin over Nickel

Termination Type

Solder

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

85°C

Standards/Approvals

CSA certified, China RoHS 2 Directive MIIT Order No 32, EU RoHS 2011/65/EU Compliant, EU ELV 2000/53/EC Compliant, 2016, UL File Number E28476, UL 94V-0

Series

2007709-1

COO (Country of Origin):
CN
The TE Connectivity High-speed backplane connector is expertly designed for seamless board-to-board connections, featuring a robust configuration of 144 positions. Tailored for modern electronic applications, it ensures enhanced performance with a mating alignment for precision. Its unshrouded design incorporates nine rows and sixteen columns, making it an excellent choice for crowded circuit board environments. Constructed from high-quality Liquid Crystal Polymer, this connector maintains both durability and reliability under various operating conditions. Ideal for sensitive signal applications, it supports high data rates while ensuring optimal impedance characteristics. With integrated features such as locating posts for alignment and compliant tail technology for secure mounting, this product guarantees a stable connection essential for high-performance systems.

Designed for efficient board-to-board connectivity

Optimised for high-frequency signal integrity

Supports up to 25 Gb/s data rates for demanding applications

Robust housing material enhances durability and reliability

Precision alignment features ensure accurate mating, mitigating connection issues

Compatible with various circuit board orientations, providing design flexibility

Low halogen content supports environmentally friendly practices

Ideal for high-density designs, maximising space utilisation

Structured to accommodate temperature ranges from -55 to 85 °C

Related links