MG Chemicals Cold Solder Solid Adhesive, 21 g
- RS Stock No.:
- 918-5009
- Mfr. Part No.:
- 8330S-21G
- Brand:
- MG Chemicals
Subtotal (1 unit)*
£133.88
(exc. VAT)
£160.66
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- Plus 29 unit(s) shipping from 02 October 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
1 + | £133.88 |
*price indicative
- RS Stock No.:
- 918-5009
- Mfr. Part No.:
- 8330S-21G
- Brand:
- MG Chemicals
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | MG Chemicals | |
Trade Name | Cold Solder | |
Adhesive Type | Conductive Epoxy Adhesive | |
Application | Thermal Management | |
Material Compatibility | Metal, Plastic | |
Product Form | Solid | |
Package Type | Syringe | |
Package Size | 21 g | |
Cure Time | 1 h | |
Viscosity Description | High Viscosity | |
Maximum Operating Temperature | +150°C | |
Minimum Operating Temperature | -40°C | |
Operating Temperature Range | -40 → +150 °C | |
Specific Gravity | 3.56 | |
Select all | ||
---|---|---|
Brand MG Chemicals | ||
Trade Name Cold Solder | ||
Adhesive Type Conductive Epoxy Adhesive | ||
Application Thermal Management | ||
Material Compatibility Metal, Plastic | ||
Product Form Solid | ||
Package Type Syringe | ||
Package Size 21 g | ||
Cure Time 1 h | ||
Viscosity Description High Viscosity | ||
Maximum Operating Temperature +150°C | ||
Minimum Operating Temperature -40°C | ||
Operating Temperature Range -40 → +150 °C | ||
Specific Gravity 3.56 | ||
- COO (Country of Origin):
- CA
MG Chemicals Conductive Epoxy
The MG Chemicals 21g silver conductive epoxy is a slow cure electronic grade adhesive that bonds to many substrates that are used in electronics assemblies. The adhesive resists thermal and mechanical shocks and has been designed for production environments when high cure temperatures can damage your heat-sensitive components. It has 0.0007ohm-cm electrical resistivity and 1.75W/(m·K) thermal conductivity.
Features and Benefits
Cure time of 120 minutes
Optimal cure temperature of only 65°C
Easy 1:1 mix ratio
Versatile
High viscosity
Cure time of 60 minutes
No freezing or dry ice required when shipping or storing
Long shelf life
Excellent water and chemical resistance
Effective for gap filling between metal plates
Excellent adhesion to most electronic substrates
Strong water and chemical resistance
Optimal cure temperature of only 65°C
Easy 1:1 mix ratio
Versatile
High viscosity
Cure time of 60 minutes
No freezing or dry ice required when shipping or storing
Long shelf life
Excellent water and chemical resistance
Effective for gap filling between metal plates
Excellent adhesion to most electronic substrates
Strong water and chemical resistance
Applications
Use for repair and assembly in optoelectronics and microelectronics
Aerospace
Marine communication
Industrial control equipment industries
Aerospace
Marine communication
Industrial control equipment industries
Certifications
RoHS certified
REACH compliant
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007
REACH compliant
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007
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