MG Chemicals 8329 TCS Liquid Thermal Adhesive, 50 ml
- RS Stock No.:
- 918-5021
- Mfr. Part No.:
- 8329TCS-50ML
- Brand:
- MG Chemicals
Subtotal (1 unit)*
£76.19
(exc. VAT)
£91.43
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 8 unit(s) ready to ship
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Units | Per unit |
---|---|
1 + | £76.19 |
*price indicative
- RS Stock No.:
- 918-5021
- Mfr. Part No.:
- 8329TCS-50ML
- Brand:
- MG Chemicals
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | MG Chemicals | |
Trade Name | 8329 TCS | |
Adhesive Type | Conductive Adhesive | |
Application | Industrial, Thermal Management | |
Material Compatibility | Ceramic, Glass, Metal, Plastic | |
Product Form | Liquid | |
Package Type | Can | |
Package Size | 50 ml | |
Cure Time | 20 min | |
Maximum Operating Temperature | +200°C | |
Specific Gravity | 2.41 | |
Minimum Operating Temperature | -70°C | |
Operating Temperature Range | -70 → +200 °C | |
Odour | Slight | |
Select all | ||
---|---|---|
Brand MG Chemicals | ||
Trade Name 8329 TCS | ||
Adhesive Type Conductive Adhesive | ||
Application Industrial, Thermal Management | ||
Material Compatibility Ceramic, Glass, Metal, Plastic | ||
Product Form Liquid | ||
Package Type Can | ||
Package Size 50 ml | ||
Cure Time 20 min | ||
Maximum Operating Temperature +200°C | ||
Specific Gravity 2.41 | ||
Minimum Operating Temperature -70°C | ||
Operating Temperature Range -70 → +200 °C | ||
Odour Slight | ||
- COO (Country of Origin):
- CA
MG Chemicals 8329 Slow Cure Conductive Adhesives
The MG Chemicals 8329TCS is a slow cure thermal conductive epoxy adhesive with excellent bonding strength and good thermal transfers is used for thermal management of high-powered electronics and LEDs. Once cured, the epoxy adhesive is inert under normal conditions so resists water and salt exposure.
Feature and Benefits
Easy to mix 1:1 mix ratio
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Long shelf life
Adheres to most electronic substrates
Behaves like a 1-part adhesive for the length of a work shift
Once cured resists thermal and mechanical shocks in electronic assemblies
Typical Applications
Use as a die attach for electrical and electronics
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat
Heat sink bonding
Use as a high-powered LED adhesive that maximises the lifetime of LEDs by dissipating their heat
Note
For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer sometimes improves adhesion.
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