The Chemtronics 0.25oz silver conductive epoxy is a two-part adhesive used in prototype, repair and general conductive bonding with a volume resistivity of less than 0.001ohm-cm. It features strong mechanical bond, excellent electrical conductivity and quick room temperature curing. The conductive epoxy bonds aggressively to a wide variety of materials and are generally compatible with most materials used in printed circuit board fabrication. As with any adhesive/sealant, compatibility with substrate should be determined on a non-critical area before use. it has an extended pot life for high strength conductive bonds. Components can be easily placed and replaced before full cure occurs and for an accelerated cure, simply heat the material to 100°C (212°F).

Cure time is 24 hours
Simple mixing ratios
High strength bond
Operating temperature ranges between -91°C (-131°F) and 100°C (212°F)
Pot life is 8-10 minutes at 25⁰C after mixing
Quick solderless electronic connections
Repairs defective traces and creates jumpers on boards
Mixed material provides 5-minute work time, fast cure
Conductive silver epoxy provides excellent electrical conductivity

Conductive bonds between heat sensitive components
Solderless surface mount connections
Circuit board trace repairs
Static discharge and grounding
Solder repairs
Conductive structural adhesions

ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007