Chemtronics CW2400 Liquid Adhesive, 14 g
- RS Stock No.:
- 496-265
- Distrelec Article No.:
- 180-86-712
- Mfr. Part No.:
- CW2400
- Brand:
- Chemtronics
Bulk discount available
Subtotal (1 unit)*
£132.93
(exc. VAT)
£159.52
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 33 unit(s) ready to ship
- Plus 36 unit(s) shipping from 24 October 2025
- Plus 24 unit(s) shipping from 24 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit |
---|---|
1 - 5 | £132.93 |
6 - 14 | £127.61 |
15 + | £124.95 |
*price indicative
- RS Stock No.:
- 496-265
- Distrelec Article No.:
- 180-86-712
- Mfr. Part No.:
- CW2400
- Brand:
- Chemtronics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Chemtronics | |
Trade Name | CW2400 | |
Adhesive Type | Conductive Adhesive | |
Application | Thermal Management | |
Material Compatibility | Metal, Plastic | |
Product Form | Liquid | |
Package Type | Syringe | |
Package Size | 14 g | |
Cure Time | 24 h | |
Select all | ||
---|---|---|
Brand Chemtronics | ||
Trade Name CW2400 | ||
Adhesive Type Conductive Adhesive | ||
Application Thermal Management | ||
Material Compatibility Metal, Plastic | ||
Product Form Liquid | ||
Package Type Syringe | ||
Package Size 14 g | ||
Cure Time 24 h | ||
- COO (Country of Origin):
- US
Chemtronics Conductive Epoxy
The Chemtronics 0.25oz silver conductive epoxy is a two-part adhesive used in prototype, repair and general conductive bonding with a volume resistivity of less than 0.001ohm-cm. It features strong mechanical bond, excellent electrical conductivity and quick room temperature curing. The conductive epoxy bonds aggressively to a wide variety of materials and are generally compatible with most materials used in printed circuit board fabrication. As with any adhesive/sealant, compatibility with substrate should be determined on a non-critical area before use. it has an extended pot life for high strength conductive bonds. Components can be easily placed and replaced before full cure occurs and for an accelerated cure, simply heat the material to 100°C (212°F).
Features and Benefits
Cure time is 24 hours
Simple mixing ratios
High strength bond
Operating temperature ranges between -91°C (-131°F) and 100°C (212°F)
Pot life is 8-10 minutes at 25⁰C after mixing
Quick solderless electronic connections
Repairs defective traces and creates jumpers on boards
Mixed material provides 5-minute work time, fast cure
Conductive silver epoxy provides excellent electrical conductivity
Simple mixing ratios
High strength bond
Operating temperature ranges between -91°C (-131°F) and 100°C (212°F)
Pot life is 8-10 minutes at 25⁰C after mixing
Quick solderless electronic connections
Repairs defective traces and creates jumpers on boards
Mixed material provides 5-minute work time, fast cure
Conductive silver epoxy provides excellent electrical conductivity
Applications
Conductive bonds between heat sensitive components
Solderless surface mount connections
Circuit board trace repairs
Static discharge and grounding
Solder repairs
Conductive structural adhesions
Solderless surface mount connections
Circuit board trace repairs
Static discharge and grounding
Solder repairs
Conductive structural adhesions
Certifications
ANSI/ESD S20.20:2014
BS EN 61340-5-1:2007
BS EN 61340-5-1:2007
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