Vishay SUD23N06-31 Type N-Channel MOSFET, 23 A, 60 V Enhancement, 3-Pin TO-252 SUD23N06-31-GE3

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£6.70

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Packaging Options:
RS Stock No.:
636-5397
Mfr. Part No.:
SUD23N06-31-GE3
Brand:
Vishay
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Brand

Vishay

Product Type

MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

23A

Maximum Drain Source Voltage Vds

60V

Series

SUD23N06-31

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

31mΩ

Channel Mode

Enhancement

Maximum Power Dissipation Pd

3W

Typical Gate Charge Qg @ Vgs

11nC

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1V

Maximum Operating Temperature

175°C

Standards/Approvals

No

Width

6.22mm

Length

6.73mm

Height

2.38mm

Automotive Standard

No

Vishay SUD23N06-31 Series MOSFET, 60V Drain Source Voltage, 23A Continuous Drain Current - SUD23N06-31-GE3


This MOSFET is a surface-mount N-channel transistor designed to switch and control power in electronic systems. It operates at voltages up to 60V and is intended for applications requiring significant continuous current handling and moderate power dissipation in a Compact TO-252 package.

Features and Benefits:


• 23 A continuous drain current for high-current switching capability
• 31 mΩ Rds(on) for reduced conduction losses and improved efficiency
• 11 nC typical gate charge for Faster switching with lower drive requirements
• 31.25W maximum power dissipation to handle thermal stress in loaded conditions
• 20V maximum gate-source voltage for robust gate-drive headroom
• -55 °C to +150 °C operating range for wide environmental tolerance

Applications


• Suitable for DC motor drivers requiring sustained high current
• Ideal for power-conversion stages in industrial automation
• Used for load switching in power-distribution assemblies
• Can be used for switch-mode power supplies in control systems

What mounting style does it use and how does that affect assembly?


It is supplied in a TO-252 surface-mount package, enabling automated soldering processes and Compact PCB layouts.

How does the device handle thermal management on a PCB?


With 31.25W maximum dissipation, it requires adequate copper area or thermal vias to spread heat from the package to the board.

What gate-drive considerations are necessary for reliable operation?


Gate drive must remain within ±20V relative to source and provide sufficient charge delivery to reach the typical 11 nC gate charge for the desired switching speed.

What electrical limits must be observed during design?


Ensure that the drain-source voltage never exceeds 60V and that continuous drain current does not surpass 23 A under the intended cooling conditions.

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