The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.

High-compliance
Low compression stress
Ultra low modulus