Bergquist 6000UL Series Self-Adhesive Thermal Gap Pad, 0.125 in Thick, 6 W/mK, 16 in, 8in, Silicone
- RS Stock No.:
- 282-6792
- Mfr. Part No.:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Brand:
- Bergquist
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- RS Stock No.:
- 282-6792
- Mfr. Part No.:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Brand:
- Bergquist
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.125in | |
| Thermal Conductivity | 6W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Width | 8in | |
| Standards/Approvals | No | |
| Length | 16in | |
| Series | 6000UL | |
| Select all | ||
|---|---|---|
Brand Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.125in | ||
Thermal Conductivity 6W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Width 8in | ||
Standards/Approvals No | ||
Length 16in | ||
Series 6000UL | ||
RoHS Status: Exempt
The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.
High-compliance
Low compression stress
Ultra low modulus
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