Spring-loaded terminal for fast multipoint testing of PCB sub-assemblies during development and production.
Designed to be pressed or epoxy bonded into pre-planned test beds, aligned with the track and pins of the board to be tested.
Stock No. 521-601 has a gold-plated brass concave probe for locating PCB pins and solder joints.
Stock No. 521-611 has a nickel plated carbon-steel pointed probe for making contact to flat track and pads.
Probe is housed in a gold-plated brass body with a gold plated spring steel spring.
Solder posts connection to terminals
Recommended test-bed thickness: 5mm min. (epoxy bonded) 12mm max., (press fit)
15 mm max.