Weller FE Attachment with Tube ESD Safe for use with WSP80/WP80/WXP80

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£41.85

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£50.22

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RS Stock No.:
389-2953
Distrelec Article No.:
182-38-627
Mfr. Part No.:
T0052918699N
Brand:
Weller
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Brand

Weller

Product Type

FE Retrofit Kit

For Use With

WSP80/WP80/WXP80

ESD Safe

Yes

Sub Type

FE Attachment with Tube

Width

6.5mm

Standards/Approvals

UPC

RoHS Status: Exempt

COO (Country of Origin):
MX

Weller FE Retrofit Kit, 6.5mm Width, ESD Safe - T0052918699N


This FE retrofit kit provides an FE attachment with tube designed for use with Weller WSP80, WP80 and WXP80 soldering stations. It is intended to upgrade compatible soldering irons by fitting an FE-style endpiece with an integrated tube, offering a straightforward replacement path while meeting UPC approval for regulatory conformity.

Features and Benefits:


• 6.5mm tip interface improves contact consistency during soldering
• ESD-safe construction reduces electrostatic risk to components
• Designed for WSP80 WP80 WXP80 ensures mechanical compatibility
• Tube-equipped attachment enables precise solder delivery control
• UPC-approved component supports recognised regulatory standards

Applications


• Suitable for refurbishing station irons to FE-style configuration
• Ideal for electronics assembly requiring ESD protection
• Used with WSP80 WP80 WXP80 in repair benches and production
• Can be used for targeted through-hole soldering tasks
• Suitable for technicians replacing worn FE attachments

Is the attachment compatible with multiple station models?


Yes, it is engineered to fit Weller WSP80, WP80 and WXP80 family tools.

How does the ESD-safe attribute affect handling?


The ESD-safe build minimises charge accumulation, protecting sensitive circuitry during contact.

What does the UPC approval indicate for this kit?


UPC approval denotes that the component meets the specified third-party conformity criteria referenced by that certification.

Does the tube affect solder flow or application?


The integrated tube directs solder locally, aiding precise application and reducing excess solder spread.

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