MPN

Infineon 650 V 6 A Rectifier & Schottky Diode 3-Pin D2PAK IDK06G65C5XTMA2

RS Stock No.:: 258-0962
Mfr. Part No.:: IDK06G65C5XTMA2
Brand:: Infineon

Infineon 650 V 6 A Rectifier & Schottky Diode 3-Pin D2PAK IDK06G65C5XTMA2

Bulk discount available

Subtotal (1 pack of 2 units)*

£4.36

(exc. VAT)

£5.24

(inc. VAT)

FREE delivery for orders over £50.00

In Stock

980 unit(s) ready to ship

Need more? Click ‘Check delivery dates’ to find extra stock and lead times.

Units	Per unit	Per Pack*
2 - 18	£2.18	£4.36
20 - 48	£1.855	£3.71
50 - 98	£1.725	£3.45
100 - 198	£1.615	£3.23
200 +	£1.485	£2.97

*price indicative

RS Stock No.:: 258-0962
Mfr. Part No.:: IDK06G65C5XTMA2
Brand:: Infineon

Specifications

Technical Reference

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Mount Type	Surface
	Product Type	Rectifier & Schottky Diode
	Package Type	TO-263
	Maximum Continuous Forward Current If	6A
	Peak Reverse Repetitive Voltage Vrrm	650V
	Series	IDK06G65C5
	Pin Count	3
	Minimum Operating Temperature	-55°C
	Maximum Forward Voltage Vf	1.8V
	Peak Reverse Current Ir	750μA
	Peak Non-Repetitive Forward Surge Current Ifsm	54A
	Maximum Operating Temperature	175°C
	Standards/Approvals	JEDEC
	Automotive Standard	No

	Select all
	Brand Infineon
	Mount Type Surface
	Product Type Rectifier & Schottky Diode
	Package Type TO-263
	Maximum Continuous Forward Current If 6A
	Peak Reverse Repetitive Voltage Vrrm 650V
	Series IDK06G65C5
	Pin Count 3
	Minimum Operating Temperature -55°C
	Maximum Forward Voltage Vf 1.8V
	Peak Reverse Current Ir 750μA
	Peak Non-Repetitive Forward Surge Current Ifsm 54A
	Maximum Operating Temperature 175°C
	Standards/Approvals JEDEC
	Automotive Standard No

Datasheet - IDK06G65C5XTMA2

The Infineon CoolSiC Schottky diodes generation 5 600V, 2 A in a DPAK real2pin package represents our leading edge technology for SiC Schottky barrier diodes. The Infineon proprietary diffusion soldering process, already introduced with G3, is now combined with a new, more compact design and thin wafer technology. The result is a new family of products showing improved efficiency over all load conditions, coming from both the improved thermal characteristics and a lower figure of merit.

No reverse recovery charge

Soft switching reverse recovery waveform

Temperature independent switching behaviour

Highly stable switching performance

Reduced cooling requirements

Reduced risks of thermal runaway