onsemi 20V 1A, Schottky Diode, 2-Pin CASE 457 MBRM120LT1G
- RS Stock No.:
- 184-4247
- Mfr. Part No.:
- MBRM120LT1G
- Brand:
- onsemi
Subtotal (1 reel of 3000 units)*
£291.00
(exc. VAT)
£348.00
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- 3,000 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
3000 + | £0.097 | £291.00 |
*price indicative
- RS Stock No.:
- 184-4247
- Mfr. Part No.:
- MBRM120LT1G
- Brand:
- onsemi
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | onsemi | |
Mounting Type | Surface Mount | |
Package Type | CASE 457 | |
Maximum Continuous Forward Current | 1A | |
Peak Reverse Repetitive Voltage | 20V | |
Diode Configuration | Single | |
Rectifier Type | Schottky Rectifier | |
Diode Type | Schottky | |
Pin Count | 2 | |
Number of Elements per Chip | 1 | |
Diode Technology | Schottky Barrier | |
Peak Non-Repetitive Forward Surge Current | 50A | |
Select all | ||
---|---|---|
Brand onsemi | ||
Mounting Type Surface Mount | ||
Package Type CASE 457 | ||
Maximum Continuous Forward Current 1A | ||
Peak Reverse Repetitive Voltage 20V | ||
Diode Configuration Single | ||
Rectifier Type Schottky Rectifier | ||
Diode Type Schottky | ||
Pin Count 2 | ||
Number of Elements per Chip 1 | ||
Diode Technology Schottky Barrier | ||
Peak Non-Repetitive Forward Surge Current 50A | ||
- COO (Country of Origin):
- MY
Low Profile - Maximum Height of 1.1 mm
Small Footprint - Footprint Area of 8.45 mm2
Low VF Provides Higher Efficiency and Extends Battery Life
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
Mechanical Characteristics:
Case: Molded Epoxy
Weight: 62 mg (approximately)
Device Marking: BCF
Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum for 10 Seconds
All Packages are Pb-Free
PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
Small Footprint - Footprint Area of 8.45 mm2
Low VF Provides Higher Efficiency and Extends Battery Life
Supplied in 12 mm Tape and Reel
Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink
Mechanical Characteristics:
Case: Molded Epoxy
Weight: 62 mg (approximately)
Device Marking: BCF
Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum for 10 Seconds
All Packages are Pb-Free
PPAP Capable
NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements
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