RS PRO White Epoxy Potting Compound 250 g
- RS Stock No.:
- 422-8218
- Brand:
- RS PRO
Currently unavailable
We don’t know if this item will be back in stock, it is being discontinued by the manufacturer.
- RS Stock No.:
- 422-8218
- Brand:
- RS PRO
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | RS PRO | |
Product Material | Epoxy | |
Package Type | Pack | |
Package Size | 250 g | |
Special Properties | Environmental Protection | |
Cure Time | 24 h | |
Hardness | 85 Shore D | |
Colour | White | |
Maximum Operating Temperature | +120°C | |
Minimum Operating Temperature | -40°C | |
Odour | Characteristic | |
Viscosity Measurement | 0.25 mPa/s at +25°C | |
Operating Temperature Range | -40 → +120 °C | |
Physical Form | Liquid | |
Select all | ||
---|---|---|
Brand RS PRO | ||
Product Material Epoxy | ||
Package Type Pack | ||
Package Size 250 g | ||
Special Properties Environmental Protection | ||
Cure Time 24 h | ||
Hardness 85 Shore D | ||
Colour White | ||
Maximum Operating Temperature +120°C | ||
Minimum Operating Temperature -40°C | ||
Odour Characteristic | ||
Viscosity Measurement 0.25 mPa/s at +25°C | ||
Operating Temperature Range -40 → +120 °C | ||
Physical Form Liquid | ||
- COO (Country of Origin):
- GB
General Purpose White
Ideal for potting electrical and electronic components and sub-assemblies
Hard, high gloss finish gives permanent (non repairable) environmental protection
Slight flexibility permits thermal expansion without stress
Low exothermic temperature rise protects components during curing
Cure time: 24 hours @25°C. Cure may be accelerated to a minimum of 30 minutes by baking at 50°C to 100°C.
Provides class E insulation
Flammability rating UL94V-0
Compatible with most printed circuit board components and materials including polystyrene capacitors
Non-staining
Hard, high gloss finish gives permanent (non repairable) environmental protection
Slight flexibility permits thermal expansion without stress
Low exothermic temperature rise protects components during curing
Cure time: 24 hours @25°C. Cure may be accelerated to a minimum of 30 minutes by baking at 50°C to 100°C.
Provides class E insulation
Flammability rating UL94V-0
Compatible with most printed circuit board components and materials including polystyrene capacitors
Non-staining
Potting Compounds: Twin Packs
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