Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635mm Pitch, 2 Row(s), Shrouded

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

PCIe 6.0/CXL 3.1 capable
Weld tabs included for a secure connection to the board
Polarized guide posts for blind mating
Optional alignment pins
0.635 mm signal pitch