Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 644-467
- Mfr. Part No.:
- UDF6-40-4-03.5-L-A-TH-TR
- Brand:
- Samtec
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Subtotal (1 unit)*
£23.89
(exc. VAT)
£28.67
(inc. VAT)
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In Stock
- 125 unit(s) ready to ship
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Units | Per unit |
|---|---|
| 1 - 9 | £23.89 |
| 10 + | £21.97 |
*price indicative
- RS Stock No.:
- 644-467
- Mfr. Part No.:
- UDF6-40-4-03.5-L-A-TH-TR
- Brand:
- Samtec
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | UDF6 | |
| Pitch | 0.635mm | |
| Current | 15A | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 240 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Gold, Tin | |
| Contact Material | Copper Alloy | |
| Row Pitch | 0.635mm | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Tail Pin Length | 3.5mm | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | |
| Voltage | 283 V | |
| Select all | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series UDF6 | ||
Pitch 0.635mm | ||
Current 15A | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 240 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Contact Plating Gold, Tin | ||
Contact Material Copper Alloy | ||
Row Pitch 0.635mm | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Tail Pin Length 3.5mm | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG | ||
Voltage 283 V | ||
The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.
PCIe 6.0/CXL 3.1 capable
Weld tabs included for a secure connection to the board
Polarized guide posts for blind mating
Optional alignment pins
0.635 mm signal pitch
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