Samtec UDF6 Series Vertical Through Hole PCB Header, 240 Contact(s), 0.635 mm Pitch, 2 Row(s), Shrouded

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£12.73

(exc. VAT)

£15.28

(inc. VAT)

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  • 125 unit(s) shipping from 03 December 2025
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RS Stock No.:
644-466
Mfr. Part No.:
UDF6-10-2-03.5-L-A-TH-TR
Brand:
Samtec
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Brand

Samtec

Series

UDF6

Product Type

PCB Header

Current

15A

Pitch

0.635mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

240

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Gold, Tin

Contact Material

Copper Alloy

Row Pitch

0.635mm

Minimum Operating Temperature

-55°C

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

3.5mm

Standards/Approvals

PCIe 6.0/CXL 3.1 Capable, PCI Express, PCI-SIG

Voltage

283 V

The Samtec High-Density and High-Speed Power/Signal Socket is an industry-leading board connector delivering best-in-class density and performance with rotated power blades for enhanced cooling, current capacity, and simplified breakout routing. Featuring an open-pin-field design, it supports up to 8 power blades and 240 signal contacts and offers a low profile 5 mm stack height. Engineered for demanding applications, it supports data rates up to 64 Gbps PAM4 and includes optional alignment/weld tabs and polarized posts for robust mating integrity.

PCIe 6.0/CXL 3.1 capable

Weld tabs included for a secure connection to the board

Polarized guide posts for blind mating

Optional alignment pins

0.635 mm signal pitch

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