Phoenix Contact FP Series Solder PCB Header, 12 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded

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Subtotal (1 pack of 400 units)*

£1,162.87

(exc. VAT)

£1,395.44

(inc. VAT)

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Per unit*
1 +£1,162.87£2.907

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RS Stock No.:
556-206
Mfr. Part No.:
1043791
Brand:
Phoenix Contact
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Brand

Phoenix Contact

Series

FP

Product Type

PCB Header

Pitch

0.8mm

Current

1.7A

Number of Contacts

12

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Solder

Connector System

ScaleX

Contact Plating

Gold over Nickel

Contact Material

Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

0.8mm

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

cULus Recognised, IEC 60068-2-27:2008-02, IEC 60068-2-6:2007-12, IEC 60112, IEC 60512-4-1:2003-05, IEC 60512-5-2:2002-02, IEC 60512-9-1:2010-03, UL 94 V0

Voltage

500 V

COO (Country of Origin):
CN
The Phoenix Contact SMD male connector, designed for robust and reliable electronic connections. Built for high-performance applications, this shielded connector is suitable for demanding environments where transfer quality is paramount. It features a unique pin layout with 12 positions optimised for effective data transmission. With a nominal current rating of 1.7 A and a test voltage of 500 V AC, this connector ensures durability and reliability in various applications. Its sleek black construction, combined with gold-plated contacts, not only enhances conductivity but also offers long-term stability, making it an excellent choice for intricate circuit designs. The FP series connectors are particularly well-regarded for their versatility and the advanced ScaleX contact system, ensuring high tolerance and uncompromised robustness.

Offers exceptional performance in high frequency applications

Optimised pin layout ensures seamless integration in printed circuit board designs

Gold plated contacts provide reliable and stable electrical connections

Designed to withstand rigorous environmental conditions with superior moisture resistance

Supports reflow soldering allowing for efficient assembly processes

Compact size facilitates flexibility in device design without compromising on electrical performance

Includes a robust shielding mechanism enhancing signal integrity and reducing electromagnetic interference

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