TE Connectivity Micro MATE-N-LOK Series Right Angle Surface Header, 18 Contact(s)

Subtotal (1 reel of 150 units)*

£594.65

(exc. VAT)

£713.58

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£594.65£3.964

*price indicative

RS Stock No.:
477-066
Mfr. Part No.:
4-794625-8
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

Micro MATE-N-LOK

Product Type

Header

Number of Contacts

18

Orientation

Right Angle

Mount Type

Surface

Connector System

MICRO MATE N LOK Connector SYSTEM

Termination Type

Solder

Maximum Operating Temperature

260°C

Standards/Approvals

2016 No Restricted Materials Above Threshold, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant, VDE Certificate

Distrelec Product Id

304-58-692

COO (Country of Origin):
CN
The TE Connectivity Exceptional 18P micro MNL assembly is designed with a right-angle SMT configuration, making it an ideal choice for space-constrained applications. With its low halogen content, it aligns with modern environmental standards, offering both performance and compliance. Built for reliability, this component supports reflow soldering up to 260°C, ensuring durability in demanding environments. The product is marked as obsolete but remains a valuable piece of technology for compatible systems. Whether you're working on new designs or maintaining existing systems, this assembly allows for seamless integration while adhering to pertinent regulations like the EU RoHS and REACH directives.

Versatile design caters to diverse industrial applications

Compliant with EU regulations, ensuring safe usage and minimal environmental impact

Low halogen materials enhance safety without sacrificing performance

Solder process capability allows for efficient assembly processes

The right-angle configuration optimises space usage in compact environments

Designed to meet a range of operational requirements while remaining user-friendly

Supports a wide array of compatible components for enhanced connectivity

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