TE Connectivity AMP HPI Series Right Angle Board PCB Header, 3 Contact(s), 1.25 mm Pitch, 1 Row(s), Shrouded

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Subtotal (1 tube of 660 units)*

£172.24

(exc. VAT)

£206.69

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£172.24£0.261

*price indicative

RS Stock No.:
475-009
Mfr. Part No.:
1734829-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Pitch

1.25mm

Current

0.8A

Number of Contacts

3

Housing Material

Polyamide 9T Fibreglass

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Row Pitch

1.25mm

Termination Type

Solder

Maximum Operating Temperature

265°C

Tail Pin Length

2.3mm

Standards/Approvals

UL 94 V-0

Voltage

125 V

Distrelec Product Id

304-50-321

COO (Country of Origin):
CN
The TE Connectivity PCB mount header is engineered for reliably connecting wires to a printed circuit board, offering an optimal solution for various electronic applications. Designed with a right-angle orientation, the header features three positions, making it ideal for compact spaces and improving circuit design efficiency. With its partially shrouded header type, it ensures secure connectivity while reducing the risk of misalignment during mating. This product is built to withstand operational voltages of up to 125 VDC, providing a robust performance in demanding environments. The housing, composed of PA 9T GF, enhances durability, while meticulous attention to plating materials ensures minimal wear and consistent conductivity over time.

Designed for wire-to-board connectivity

Offers increased flexibility with right-angle PCB mount orientation

Features a partially shrouded design for enhanced mating security

Constructed from durable materials to withstand various environmental factors

Operates efficiently under high voltage conditions

Minimises the risk of misalignment due to its advanced design

Provides a compact footprint for space-constrained applications

Facilitates straightforward soldering and assembly processes

Reduces contact wear through quality plating materials

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