onsemi PowerTrench P-Channel MOSFET, 2.4 A, 20 V, 3-Pin SOT-23 FDN304P

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£3.07

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£3.685

(inc. VAT)

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5 - 45£0.614£3.07
50 - 95£0.53£2.65
100 - 495£0.458£2.29
500 - 995£0.404£2.02
1000 +£0.368£1.84

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Packaging Options:
RS Stock No.:
671-0403
Mfr. Part No.:
FDN304P
Brand:
onsemi
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Brand

onsemi

Channel Type

P

Maximum Continuous Drain Current

2.4 A

Maximum Drain Source Voltage

20 V

Package Type

SOT-23

Series

PowerTrench

Mounting Type

Surface Mount

Pin Count

3

Maximum Drain Source Resistance

52 mΩ

Channel Mode

Enhancement

Minimum Gate Threshold Voltage

0.4V

Maximum Power Dissipation

500 mW

Transistor Configuration

Single

Maximum Gate Source Voltage

-8 V, +8 V

Typical Gate Charge @ Vgs

12 nC @ 4.5 V

Width

1.4mm

Maximum Operating Temperature

+150 °C

Transistor Material

Si

Number of Elements per Chip

1

Length

2.92mm

Height

0.94mm

Minimum Operating Temperature

-55 °C

PowerTrench® P-Channel MOSFET, Fairchild Semiconductor


PowerTrench® MOSFETs are optimised power switches that offer increase of system efficiency and power density. They combine small gate charge(Qg), small reverse recovery charge(Qrr) and soft reverse recovery body diode, which contributes to fast switching of synchronous rectification in AC/DC power supplies.
The latest PowerTrench® MOSFETs employa shielded-gate structure that provides charge balance. By utilizing this advanced technology, the FOM (Figure of Merit) of these devices is significant lower than that of previous generations.
Soft body diode performance of the PowerTrench® MOSFETs is able to eliminate snubber circuits or replace a higher voltage rating MOSFET.


MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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