onsemi PowerTrench Dual P-Channel MOSFET, 1.9 A, 20 V, 6-Pin SOT-23 FDC6306P

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Subtotal (1 reel of 3000 units)*

£516.00

(exc. VAT)

£618.00

(inc. VAT)

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Units
Per unit
Per Reel*
3000 +£0.172£516.00

*price indicative

RS Stock No.:
166-2972
Mfr. Part No.:
FDC6306P
Brand:
onsemi
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Brand

onsemi

Channel Type

P

Maximum Continuous Drain Current

1.9 A

Maximum Drain Source Voltage

20 V

Package Type

SOT-23

Series

PowerTrench

Mounting Type

Surface Mount

Pin Count

6

Maximum Drain Source Resistance

270 mΩ

Channel Mode

Enhancement

Minimum Gate Threshold Voltage

0.4V

Maximum Power Dissipation

960 mW

Transistor Configuration

Isolated

Maximum Gate Source Voltage

-8 V, +8 V

Typical Gate Charge @ Vgs

3 nC @ 4.5 V

Number of Elements per Chip

2

Transistor Material

Si

Maximum Operating Temperature

+150 °C

Length

3mm

Width

1.7mm

Height

1mm

Minimum Operating Temperature

-55 °C

PowerTrench® Dual P-Channel MOSFET, Fairchild Semiconductor


PowerTrench® MOSFETs are optimised power switches that offer increase of system efficiency and power density. They combine small gate charge(Qg), small reverse recovery charge(Qrr) and soft reverse recovery body diode, which contributes to fast switching of synchronous rectification in AC/DC power supplies.
The latest PowerTrench® MOSFETs, employ shielded-gate structure that provides charge balance. By utilizing this advanced technology, the FOM (Figure of Merit) of these devices is significant lower than that of previous generation.
Soft body diode performance of the PowerTrench® MOSFETs is able to eliminate snubber circuit or replace a higher voltage rating MOSFET.


MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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