TE Connectivity 0.5 mm Pitch 260 Way, Right Angle Board Mount DIMM Socket ,1.2 V, 500mA

Subtotal (1 reel of 450 units)*

£527.26

(exc. VAT)

£632.71

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£527.26£1.172

*price indicative

RS Stock No.:
481-903
Distrelec Article No.:
304-59-550
Mfr. Part No.:
2309407-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Current

500mA

Contact Plating

Gold

Number of Contacts

260

Pitch

0.5mm

Mount Type

Board

Housing Material

High Temperature Thermoplastic

Latching

Yes

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Row Spacing

8.2mm

Maximum Operating Temperature

85°C

Standards/Approvals

UL 94V-0, 2016, EU ELV Directive 2000/53/EC, EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006

Voltage

1.2 V

Series

DDR4 DIMM

COO (Country of Origin):
CN
The TE Connectivity Small Outline (SO) DDR4 DIMM Socket is designed for precision and reliability in modern electronic applications. Featuring a stack height of just 4 mm, this right angle module orientation facilitates seamless integration into compact configurations. With 260 positions and a 0.5 mm centerline, it supports high-speed data transfer, ideal for performance-driven environments. Designed for surface mounting, this socket guarantees durability with a robust construction of high-temperature thermoplastic, ensuring long-lasting operation in various conditions. Its advanced engineering accommodates an operating temperature range from -55 to 85 °C, making it suitable for both consumer and industrial applications. Elevate your designs with a product that embodies innovative connector technology and outstanding compliance with industry standards.

Ensures efficient space utilization due to its compact design

Facilitates easy installation with a user-friendly mounting type

Utilizes gold flash plating for enhanced conductivity and reliability

Offers dual ejector location to support flexibly mounted modules

Incorporates a standard keying alignment for precise fits

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