TE Connectivity, 1-2069 Memory Card Connector, Solder
- RS Stock No.:
- 471-873
- Distrelec Article No.:
- 304-62-864
- Mfr. Part No.:
- 1-2069838-3
- Brand:
- TE Connectivity
Subtotal (1 tray of 25 units)*
£163.47
(exc. VAT)
£196.16
(inc. VAT)
FREE delivery for orders over £60.00
Stocked by manufacturer
- Ready to ship from 01 June 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | £163.47 | £6.539 |
*price indicative
- RS Stock No.:
- 471-873
- Distrelec Article No.:
- 304-62-864
- Mfr. Part No.:
- 1-2069838-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | Memory Card Connector | |
| Number of Rows | 1 | |
| Pitch | 2.5mm | |
| Orientation | Straight | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | |
| Series | 1-2069 | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type Memory Card Connector | ||
Number of Rows 1 | ||
Pitch 2.5mm | ||
Orientation Straight | ||
Termination Type Solder | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU RoHS 2011/65/EU, 2016, China RoHS 2 MIIT Order No 32, EU REACH (EC) No. 1907/2006, EU ELV 2000/53/EC | ||
Series 1-2069 | ||
- COO (Country of Origin):
- US
The TE Connectivity product represents cutting-edge engineering with its LGA115X design, ideal for applications requiring reliable thermal interfaces. Positioned as a fundamental component in high-performance computing systems, it enhances both thermal efficiency and reliability. Constructed with meticulous attention to detail, this solution ensures compatibility across various systems while simplifying the installation process. The innovative design caters to the evolving demands of technology, making it a robust choice for both advanced users and general consumers alike.
Optimized for effective thermal management within compact environments
Designed to integrate seamlessly with modern computing systems
Facilitates straightforward installation for users of all levels
Resilient build quality ensures longevity and reliability in performance
Enhances system efficiency through advanced engineering techniques
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