Infineon 256 kB Parallel FRAM 28-Pin SOIC

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Subtotal (1 tube of 27 units)*

£385.938

(exc. VAT)

£463.131

(inc. VAT)

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  • Plus 243 unit(s) shipping from 10 August 2026
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Units
Per unit
Per Tube*
27 - 27£14.294£385.94
54 - 81£14.109£380.94
108 +£13.179£355.83

*price indicative

RS Stock No.:
188-5426
Mfr. Part No.:
FM28V020-SG
Brand:
Infineon
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Brand

Infineon

Memory Size

256kB

Product Type

FRAM

Organisation

32K x 8 bit

Interface Type

Parallel

Data Bus Width

8bit

Maximum Random Access Time

70ns

Mount Type

Surface

Package Type

SOIC

Pin Count

28

Height

1.38mm

Length

4.97mm

Standards/Approvals

No

Width

3.98mm

Maximum Operating Temperature

85°C

Maximum Supply Voltage

3.6V

Automotive Standard

AEC-Q100

Number of Words

32k

Number of Bits per Word

8

Minimum Operating Temperature

-40°C

Minimum Supply Voltage

2V

COO (Country of Origin):
US

Infineon FRAM, 256kB Memory Size, 3.6V Maximum Supply Voltage - FM28V020-SG


This FRAM is a non-volatile memory device designed for embedded systems requiring frequent write cycles and low-power operation. It operates across a reduced-voltage range suitable for battery-powered and mixed-voltage environments and communicates via a parallel interface for rapid data transfer in compact electronic assemblies.

Features and Benefits:


• 256kB capacity offering substantial persistent storage
• 8-bit data bus enabling byte-wide read/write operations
• 70ns maximum random access time supporting fast retrieval
• Operates from 2.0-3.6V to minimise power consumption
• Qualified to Automotive AEC-Q100 for vehicular use
• 28-pin SOIC surface-mount package for automated assembly

Applications


• Suitable for automotive control unit data logging
• Ideal for industrial sensor calibration storage
• Used with low-voltage embedded devices requiring endurance
• Can be used for parameter storage in safety systems
• Used for rapid-read lookup tables in control firmware

What temperature range can it withstand during operation?


It functions across an industrial span from -40 to 85°C, allowing deployment in harsh ambient conditions.

What physical size should designers allow on the PCB?


The device mounts as a surface component with a footprint corresponding to a 28-pin SOIC and a package envelope measuring 4.97mm by 3.98mm with a height of 1.38 mm.

How is memory organised for software addressing?


The memory is arranged as 32K words of 8 bits, providing straightforward byte-addressable storage for firmware.

Which interface should be routed for connection?


A parallel bus must be implemented to match the device’s parallel interface operation and 8-bit data width.

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