Infineon 256 kB FRAM 8-Pin SOIC, FM24V02A-G
- RS Stock No.:
- 124-2983
- Mfr. Part No.:
- FM24V02A-G
- Brand:
- Infineon
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- Plus 850 unit(s) shipping from 10 August 2026
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Units | Per unit | Per Pack* |
|---|---|---|
| 2 - 8 | £5.25 | £10.50 |
| 10 - 18 | £4.175 | £8.35 |
| 20 - 98 | £4.065 | £8.13 |
| 100 - 498 | £3.96 | £7.92 |
| 500 + | £3.855 | £7.71 |
*price indicative
- RS Stock No.:
- 124-2983
- Mfr. Part No.:
- FM24V02A-G
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Memory Size | 256kB | |
| Product Type | FRAM | |
| Organisation | 32K x 8 bit | |
| Data Bus Width | 8bit | |
| Maximum Random Access Time | 450ns | |
| Maximum Clock Frequency | 3.4MHz | |
| Mount Type | Surface | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Length | 4.97mm | |
| Width | 3.98mm | |
| Standards/Approvals | No | |
| Height | 1.38mm | |
| Maximum Operating Temperature | 85°C | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Supply Voltage | 2V | |
| Number of Bits per Word | 8 | |
| Automotive Standard | AEC-Q100 | |
| Minimum Operating Temperature | -40°C | |
| Number of Words | 32k | |
| Select all | ||
|---|---|---|
Brand Infineon | ||
Memory Size 256kB | ||
Product Type FRAM | ||
Organisation 32K x 8 bit | ||
Data Bus Width 8bit | ||
Maximum Random Access Time 450ns | ||
Maximum Clock Frequency 3.4MHz | ||
Mount Type Surface | ||
Package Type SOIC | ||
Pin Count 8 | ||
Length 4.97mm | ||
Width 3.98mm | ||
Standards/Approvals No | ||
Height 1.38mm | ||
Maximum Operating Temperature 85°C | ||
Maximum Supply Voltage 3.6V | ||
Minimum Supply Voltage 2V | ||
Number of Bits per Word 8 | ||
Automotive Standard AEC-Q100 | ||
Minimum Operating Temperature -40°C | ||
Number of Words 32k | ||
Infineon FRAM, 256kB Memory Size, 3.6V Maximum Supply Voltage - FM24V02A-G
This FRAM is a non-volatile memory device designed for embedded and automotive environments, offering persistent data storage with low-voltage operation. It functions as byte-addressable memory in a compact surface-mount package and is suitable for systems needing frequent writes and long data retention across power cycles. The device operates across a wide temperature span for demanding industrial or vehicular installations.
Features and Benefits:
• 256kB capacity provides substantial onboard data retention
• Random access time 450ns enables quick read/write responsiveness
• Clock rate up to 3.4MHz supports high-speed serial transfers
• Operates from 2V to 3.6V for low-voltage system compatibility
• Organised as 32Kx8 for straightforward byte-oriented interfacing
• Meets AEC‑Q100, enabling automotive-grade component selection
• Random access time 450ns enables quick read/write responsiveness
• Clock rate up to 3.4MHz supports high-speed serial transfers
• Operates from 2V to 3.6V for low-voltage system compatibility
• Organised as 32Kx8 for straightforward byte-oriented interfacing
• Meets AEC‑Q100, enabling automotive-grade component selection
Applications
• Suitable for automotive control-module parameter storage
• Ideal for instrument clusters and ECU data logging
• Used with industrial controllers in harsh temperatures
• Can be used for frequent-logging sensor data buffers
• Used for boot-code storage in low-voltage systems
• Ideal for instrument clusters and ECU data logging
• Used with industrial controllers in harsh temperatures
• Can be used for frequent-logging sensor data buffers
• Used for boot-code storage in low-voltage systems
What package and mounting style does it use?
The device is supplied in an 8-pin SOIC package intended for surface-mount assembly.
What pin and data-bus configuration should designers expect?
It presents an 8-bit data bus across 8 pins allowing standard parallel byte transfers via the serial-interface mapping used in system designs.
What environmental limits must be considered for deployment?
The component is rated to function between -40°C and 85°C, suitable for industrial and many automotive ambient ranges.
How compact is the device for board-level placement?
The package measures 4.97mm in length and 3.98mm in width with a height of 1.38mm, permitting dense PCB layouts.
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