Weller Desoldering Nozzle for use with CV-H5-DS Hand Pieces, MX-DS1, MX-5200, MX-500, MX-5000, CV-5200 Systems

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£11.27

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RS Stock No.:
405-3496
Distrelec Article No.:
182-27-712
Mfr. Part No.:
T0051314099
Brand:
Weller
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Brand

Weller

Product Type

Desoldering Nozzle

For Use With

CV-H5-DS Hand Pieces, MX-DS1, MX-5200, MX-500, MX-5000, CV-5200 Systems

Tip Series

DX110

Tip Width

1.9 mm

Tip Shape

Straight Conical

Tip Length

25mm

Standards/Approvals

UPC

RoHS Status: Exempt

Weller Desoldering Nozzle, 1.9mm Tip Width, 25mm Tip Length - T0051314099


This desoldering nozzle is a suction-style tip designed for precision removal of solder in handheld and system-mounted desoldering equipment. It is intended to operate as a consumable replacement for compatible Weller desoldering handpieces and central vacuum systems, providing a focussed extraction path for molten solder during repair and rework tasks.

Features and Benefits:


• 1.9mm opening for accurate solder extraction
• 25mm length for extended reach in confined areas
• Suction nozzle shape for efficient material removal
• UPC approval indicating standardised production quality
• Compatible design minimises downtime during tip changes

Applications


• Used with CV-H5-DS handpieces in repair benches
• Suitable for MX-DS1 setup integrations
• Used for MX-5200 compatible desoldering systems
• Compatible with MX-500 and MX-5000 system installations
• Suitable for integration into CV-5200 desoldering lines

Which handpieces will accept this nozzle?


It fits CV-H5-DS style handpieces that use replaceable suction tips.

Can it be used in modular central systems?


Yes, it is compatible with various MX and CV series central desoldering systems designed for interchangeable nozzles.

What is the primary functional advantage of the nozzle shape?


The suction nozzle profile directs and concentrates airflow to evacuate molten solder effectively from the work area.

How does the nozzle support precision tasks?


The narrow 1.9mm aperture enables controlled extraction on small pads and tight component layouts without affecting adjacent sites.

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