Molex 173113 44 Way Straight 1.98 mm Pitch Panel Mount D-Sub Connector, with Flange Female

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Subtotal (1 tray of 50 units)*

£152.78

(exc. VAT)

£183.34

(inc. VAT)

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RS Stock No.:
507-405
Distrelec Article No.:
304-56-116
Mfr. Part No.:
173113-0063
Brand:
Molex
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Brand

Molex

Product Type

D-Sub Connector

Number of Contacts

44

Current

3A

Orientation

Straight

Mount Type

Panel Mount

Connector Gender

Female

Connector Type D

High Density

D-Sub Shell Size

3

Mounting Hardware

Flange

Housing Material

Polybutylene Terephthalate

Minimum Operating Temperature

-55°C

Termination Type

Solder Cup

Contact Gender

Female

Maximum Operating Temperature

105°C

Standards/Approvals

IEC-62474, IPC 1752A Class D, IPC 1752A Class C, EU RoHS

Contact Material

Copper Alloy

Series

173113

Contact Plating

Gold over Nickel

Pitch

1.98mm

COO (Country of Origin):
TW
The TE Connectivity FCT High-Density D-Sub Connector is expertly designed to meet the demanding requirements of modern electronic connectivity. With a robust construction featuring a gold-plated solder cup configuration, it ensures reliable performance in a variety of applications. This connector, accommodating up to 44 circuits, is tailored for efficient data transmission, making it an ideal choice for high-density environments. Its straight orientation and rear panel mounting capability provide versatile installation options. The connector's IP20 rating highlights its suitability for applications where protection from dust is essential, while its durable materials ensure longevity and stable electrical performance. The FCT connector stands out in the marketplace for its combination of functionality, reliability, and compliance with industry standards, making it a top choice for engineers and designers alike.

Accommodates up to 44 circuits for maximum connectivity

Solder cup termination style simplifies installation

IP20 rating offers essential protection against dust ingress

Constructed with durable materials for extended lifespan

Compatible with a wide range of high-density applications

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