TGlobal TG Series Thermal Interface Pad, 2mm Thick, 3W/m·K, FibreGlass Mesh, Silicone

Plug-in style heatsink featuring four spring action clips,Firmly hold the device to the heatsink ensuring maximum metal to metal thermal contact,Available with or without solderable mounting tabs for both horizontal and vertical mounting to the PC board

The TGlobal Fiberglass Mesh Series Thermal Pad is suitable for voltage resistant products. This thermal pad is suitable for use in a wide range of industries, including 5G, aerospace, AI, AIoT, AR/VR/MR/XR, automotive, consumer devices, Datacom, electric vehicles, electronic products, energy storage, industrial equipment, lighting, medical devices, military applications, Netcom, panels, power electronics, robotics, servers, smart home technologies, and telecommunications.

High thermal conductivity
Fiberglass on one side
Non-deforming
Electrical insulation
REACH compliant
RoHS compliant
UL compliant