Hirose original 1.27mm pitch High-Density I/O connectors

1.27mm (0.050'') contact spacing conserves valuable board space and permits ultra-high density designs.
Bellow contacts create smooth and precise mating and unmating.
Unique shell design assures first make/mast break grounding and overall noise protection.
IDC termination allows quick and low cost termination to AWG #28 and #30 wires.
Back Shell and receptacle shell are made of diecast zinc alloy to reduce the penetration of external EMI noise.
Easy to use 'One-Touch' and 'Screw' locking mechanisms assure quick and easy 'positive' closures every time.
Termination method is available in IDC, Soldering, Right Angle Dip, Straight Dip and SMT.
DX with 3 cavities and 2 cavities for Co-axial contacts are newly introduced to meet the needs of high speed data transmission.
Shielded Plug-in type for interface between 2 Units available.