STMicroelectronics MLPF-WB55-01E3 RF Transceiver, 6-Pin Bumpless CSP
- RS Stock No.:
- 192-4203
- Mfr. Part No.:
- MLPF-WB55-01E3
- Brand:
- STMicroelectronics
Bulk discount available
View bulk pricing optionsSubtotal (1 pack of 25 units)*
£4.925
(exc. VAT)
£5.90
(inc. VAT)
FREE delivery for orders over £60.00
Temporarily out of stock
- Shipping from 28 September 2026
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Units | Per unit | Per Pack* |
|---|---|---|
| 25 - 100 | £0.197 | £4.93 |
| 125 - 225 | £0.187 | £4.68 |
| 250 - 600 | £0.168 | £4.20 |
| 625 - 1225 | £0.151 | £3.78 |
| 1250 + | £0.144 | £3.60 |
*price indicative
- RS Stock No.:
- 192-4203
- Mfr. Part No.:
- MLPF-WB55-01E3
- Brand:
- STMicroelectronics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | STMicroelectronics | |
| Technology | IPD on Non-Conductive Glass Substrate | |
| Product Type | RF Transceiver | |
| Sub Type | RF Transceiver | |
| Package Type | Bumpless CSP | |
| Pin Count | 6 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 2500MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | ECOPACK2 | |
| Length | 1.63mm | |
| Series | MLPF-WB55 | |
| Number of Operating Bands | 1 | |
| Automotive Standard | No | |
| Select all | ||
|---|---|---|
Brand STMicroelectronics | ||
Technology IPD on Non-Conductive Glass Substrate | ||
Product Type RF Transceiver | ||
Sub Type RF Transceiver | ||
Package Type Bumpless CSP | ||
Pin Count 6 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 2500MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals ECOPACK2 | ||
Length 1.63mm | ||
Series MLPF-WB55 | ||
Number of Operating Bands 1 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Integrated impedance matching to STM32WB55Cx and STM32WB55Rx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
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