BGA7L1BN6E6327XTSA1 Infineon RF Amplifier Low Noise 13.6 dB, 6-Pin 960MHz TSNP-6-2

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£3.30

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£4.00

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10 - 990£0.33£3.30
1000 - 1990£0.26£2.60
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5000 - 9990£0.249£2.49
10000 +£0.245£2.45

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RS Stock No.:
273-5226
Mfr. Part No.:
BGA7L1BN6E6327XTSA1
Brand:
Infineon
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Brand

Infineon

Product Type

RF Amplifier

Amplifier Type

Low Noise

Operating Frequency

960MHz

Technology

Silicon Germanium

Gain

13.6dB

Mount Type

Surface

Minimum Supply Voltage

1.5V

Package Type

TSNP-6-2

Maximum Supply Voltage

3.6V

Pin Count

6

Third Order Intercept OIP3

5dBm

Minimum Operating Temperature

-40°C

Noise Figure

0.75dB

Maximum Operating Temperature

85°C

Width

0.7mm

Standards/Approvals

JEDEC47/20/22

Length

1.1mm

Height

0.37mm

Series

BGA7L1BN6

Automotive Standard

No

COO (Country of Origin):
MY

Infineon BGA7L1BN6 Series RF Amplifier, 13.6dB Gain, 0.70dB Noise Figure - BGA7L1BN6E6327XTSA1


This RF amplifier is a silicon-germanium low-noise device designed to boost weak RF signals within communication systems. It operates around 960MHz and is intended for surface-mounted applications where a low-voltage supply and Compact footprint are required. The component is specified for non-automotive environments and functions across a wide ambient temperature range.

Features and Benefits:


• 13.6dB gain improves signal strength for front-end reception
• 0.70dB noise figure reduces added noise during amplification
• OIP3 5 dBm enhances linearity under moderate input power
• 1.5 to 3.6V supply supports low-voltage system designs
• TSNP-6-2 surface-mount package enables Compact PCB layouts

Applications


• Suitable for 960MHz receiver front ends
• Ideal for SiGe low-noise RF designs
• Used with Compact wireless modules requiring low NF
• Can be used for low-voltage portable RF equipment
• Suitable for 6-pin RF amplifier package integration

What temperature range can it reliably operate within?


It is rated to operate between -40 and 85°C.

How many pins does the package present for PCB layout?


The device uses a 6-pin arrangement in a TSNP-6-2 package.

What technology is employed in the transistor structure?


The amplifier uses silicon-germanium technology.

What mounting method is required for assembly?


It is intended for surface mounting onto the PCB.

What standard approvals relate to environmental handling?


The component meets JEDEC 47/20/22 approvals.

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