MPN

BGA725L6E6327FTSA1 Infineon RF Amplifier Low Noise 20 dB, 6-Pin 1615MHz TSLP

RS Stock No.:: 258-0663
Mfr. Part No.:: BGA725L6E6327FTSA1
Brand:: Infineon

BGA725L6E6327FTSA1 Infineon RF Amplifier Low Noise 20 dB, 6-Pin 1615MHz TSLP

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Subtotal (1 pack of 10 units)*

£2.34

(exc. VAT)

£2.81

(inc. VAT)

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In Stock

29,250 unit(s) ready to ship

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Units	Per unit	Per Pack*
10 - 90	£0.234	£2.34
100 - 240	£0.223	£2.23
250 - 490	£0.213	£2.13
500 - 990	£0.204	£2.04
1000 +	£0.19	£1.90

*price indicative

RS Stock No.:: 258-0663
Mfr. Part No.:: BGA725L6E6327FTSA1
Brand:: Infineon

Specifications

Technical Reference

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	Infineon
	Operating Frequency	1615MHz
	Amplifier Type	Low Noise
	Product Type	RF Amplifier
	Technology	Silicon Germanium
	Gain	20dB
	Mount Type	Surface
	Package Type	TSLP
	Minimum Supply Voltage	1.5V
	Pin Count	6
	Maximum Supply Voltage	3.6V
	Minimum Operating Temperature	-40°C
	P1dB - Compression Point	72mW
	Noise Figure	0.65dB
	Third Order Intercept OIP3	-5dBm
	Maximum Operating Temperature	85°C
	Standards/Approvals	RoHS
	Automotive Standard	No
	Series	BGA

	Select all
	Brand Infineon
	Operating Frequency 1615MHz
	Amplifier Type Low Noise
	Product Type RF Amplifier
	Technology Silicon Germanium
	Gain 20dB
	Mount Type Surface
	Package Type TSLP
	Minimum Supply Voltage 1.5V
	Pin Count 6
	Maximum Supply Voltage 3.6V
	Minimum Operating Temperature -40°C
	P1dB - Compression Point 72mW
	Noise Figure 0.65dB
	Third Order Intercept OIP3 -5dBm
	Maximum Operating Temperature 85°C
	Standards/Approvals RoHS
	Automotive Standard No
	Series BGA

Datasheet - BGA725L6E6327FTSA1

Infineon BGA Series RF Amplifier, 20dB Gain, 1615MHz Operating Frequency - BGA725L6E6327FTSA1

This RF amplifier is a low-noise silicon-germanium device designed for surface-mount applications operating around 1615MHz. It amplifies weak signals while functioning across a broad supply range and is suited to systems requiring Compact packaged radio-frequency gain in commercial temperature environments.

Features and Benefits:

• 20dB gain improves weak-signal reception and link margin
• 0.65dB noise figure reduces added system noise floor
• 1.5V to 3.6V supply range enables flexible powering options
• P1dB 72 mW output prevents early saturation under drive
• OIP3 -5 dBm linearity preserves signal fidelity at high levels

Applications

• Suitable for front-end receiver stages in RF modules
• Ideal for satellite communication downlink receivers
• Used with surface-mount transceiver assemblies on Compact boards
• Can be used for signal conditioning in telemetry links
• Applicable to gain stages in wireless infrastructure equipment

What thermal limits should be considered for operation?

The device operates between -40°C and 85°C, so thermal management should maintain junction temperature within this range.

How many connections are required on the PCB footprint?

The component uses a 6‑pin surface-mount package, requiring six solder pads for electrical and mechanical attachment.

What fabrication technology defines its semiconductor behaviour?

It employs silicon-germanium technology, which provides RF performance characteristics suitable for low-noise amplification.

Is the product compliant with environmental material standards?

It meets RoHS requirements restricting certain hazardous substances in electronic assemblies.

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